APA (7th ed.) Citation

Li, J., Agyakwa, P., Evans, P., Johnson, C. M., Zhao, Y., Wu, Y., & Evans, K. (2014). Packaging/assembling technologies for a high performance SiC-based planar power module.

Chicago Style (17th ed.) Citation

Li, Jianfeng, Pearl Agyakwa, Paul Evans, Christopher Mark Johnson, Yimin Zhao, Yibo Wu, and Kim Evans. Packaging/assembling Technologies for a High Performance SiC-based Planar Power Module. 2014.

MLA (9th ed.) Citation

Li, Jianfeng, et al. Packaging/assembling Technologies for a High Performance SiC-based Planar Power Module. 2014.