Sintered-silver bonding of high-temperature piezoelectric ceramic sensors
Silver sintering is used to bond five components together, in order to form a piezoelectric sensor. A description is provided of the preparation of these components, and of the manufacturing steps, which are carried out at a low temperature (280 °C). The resulting sensor assemblies are then cha...
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IEEE
2017
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| Online Access: | https://eprints.nottingham.ac.uk/44150/ |
| _version_ | 1848796848622403584 |
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| author | Billore, Justine Hascoët, Stanislas Robutel, Rémi Buttay, Cyril Li, Jianfeng |
| author_facet | Billore, Justine Hascoët, Stanislas Robutel, Rémi Buttay, Cyril Li, Jianfeng |
| author_sort | Billore, Justine |
| building | Nottingham Research Data Repository |
| collection | Online Access |
| description | Silver sintering is used to bond five components together, in order to form a piezoelectric sensor. A description is provided of the preparation of these components, and of the manufacturing steps, which are carried out at a low temperature (280 °C).
The resulting sensor assemblies are then characterized: cross-sectional views show that the silver layer has a very dense struc-ture, with less than 1 % porosity, although further focused-ion beam investigations show that this porosity is closer to 15 %. The shear strength is approximately 30 MPa. The Young's modulus of the silver bondline is measured using nanoindentation, and is found to be comparable with that of bulk silver (56.6 GPa). Finally, a silver-sintered sensor is compared with a sensor bonded using conventional techniques, showing that an improvement in sensitivity by a factor of more than 3 is achieved. |
| first_indexed | 2025-11-14T19:54:30Z |
| format | Article |
| id | nottingham-44150 |
| institution | University of Nottingham Malaysia Campus |
| institution_category | Local University |
| last_indexed | 2025-11-14T19:54:30Z |
| publishDate | 2017 |
| publisher | IEEE |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | nottingham-441502020-05-04T18:28:51Z https://eprints.nottingham.ac.uk/44150/ Sintered-silver bonding of high-temperature piezoelectric ceramic sensors Billore, Justine Hascoët, Stanislas Robutel, Rémi Buttay, Cyril Li, Jianfeng Silver sintering is used to bond five components together, in order to form a piezoelectric sensor. A description is provided of the preparation of these components, and of the manufacturing steps, which are carried out at a low temperature (280 °C). The resulting sensor assemblies are then characterized: cross-sectional views show that the silver layer has a very dense struc-ture, with less than 1 % porosity, although further focused-ion beam investigations show that this porosity is closer to 15 %. The shear strength is approximately 30 MPa. The Young's modulus of the silver bondline is measured using nanoindentation, and is found to be comparable with that of bulk silver (56.6 GPa). Finally, a silver-sintered sensor is compared with a sensor bonded using conventional techniques, showing that an improvement in sensitivity by a factor of more than 3 is achieved. IEEE 2017-01-31 Article PeerReviewed Billore, Justine, Hascoët, Stanislas, Robutel, Rémi, Buttay, Cyril and Li, Jianfeng (2017) Sintered-silver bonding of high-temperature piezoelectric ceramic sensors. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7 (1). pp. 3-9. ISSN 2156-3985 Silver Temperature sensors Vibrations Bonding Ceramics http://ieeexplore.ieee.org/document/7786896/ doi:10.1109/TCPMT.2016.2628874 doi:10.1109/TCPMT.2016.2628874 |
| spellingShingle | Silver Temperature sensors Vibrations Bonding Ceramics Billore, Justine Hascoët, Stanislas Robutel, Rémi Buttay, Cyril Li, Jianfeng Sintered-silver bonding of high-temperature piezoelectric ceramic sensors |
| title | Sintered-silver bonding of high-temperature piezoelectric ceramic sensors |
| title_full | Sintered-silver bonding of high-temperature piezoelectric ceramic sensors |
| title_fullStr | Sintered-silver bonding of high-temperature piezoelectric ceramic sensors |
| title_full_unstemmed | Sintered-silver bonding of high-temperature piezoelectric ceramic sensors |
| title_short | Sintered-silver bonding of high-temperature piezoelectric ceramic sensors |
| title_sort | sintered-silver bonding of high-temperature piezoelectric ceramic sensors |
| topic | Silver Temperature sensors Vibrations Bonding Ceramics |
| url | https://eprints.nottingham.ac.uk/44150/ https://eprints.nottingham.ac.uk/44150/ https://eprints.nottingham.ac.uk/44150/ |