Sintered-silver bonding of high-temperature piezoelectric ceramic sensors
Silver sintering is used to bond five components together, in order to form a piezoelectric sensor. A description is provided of the preparation of these components, and of the manufacturing steps, which are carried out at a low temperature (280 °C). The resulting sensor assemblies are then cha...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Published: |
IEEE
2017
|
| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/44150/ |