Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

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Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

An alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes is presented. This flat switch, which is designed for high-frequency application with high power density, exhibits high strength, high toughness, low parasitic inductance and high thermal conductivity. Su...

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Bibliographic Details
Main Authors:	Cova, P., Delmonte, N., Solomon, A.K., Castellazzi, Alberto
Format:	Article
Published:	Elsevier 2016
Subjects:	High power density Packaging System integration Inverter Thermal design
Online Access:	https://eprints.nottingham.ac.uk/43872/

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