Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability
An alternative integration scheme for a half-bridge switch using 70 μm thin Si IGBTs and diodes is presented. This flat switch, which is designed for high-frequency application with high power density, exhibits high strength, high toughness, low parasitic inductance and high thermal conductivity. Su...
| Main Authors: | , , , |
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| Format: | Article |
| Published: |
Elsevier
2016
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/43872/ |