A physical RC network model for electro-thermal analysis of a multichip SiC power module
This paper is concerned with the thermal models which can physically reflect the heat-flow paths in a lightweight three-phase half bridge, two-level SiC power module with 6 MOSFETs and can be used for coupled electro-thermal simulation. The finite element (FE) model was first evaluated and calibrate...
| Main Authors: | , , , , , |
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| Format: | Article |
| Published: |
IEEE
2017
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/42231/ |