Modular plug-in high performance integrated single-phase inverter
The recent research exercises have targeted the transfer of the sandwich package benefits to application bespoke switch design, including flip-chip and device stacking topology [1]. This work presents the development of a highly integrated power switch, based on 70μm thin IGBTs and diodes rated at 6...
| Main Authors: | , |
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| Format: | Conference or Workshop Item |
| Published: |
2016
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/41654/ |