Mouawad, B., Li, J., Castellazzi, A., Johnson, C. M., Erlbacher, T., & Friedriches, P. (2016). Low inductance 2.5kV packaging technology for SiC switches.
Chicago Style (17th ed.) CitationMouawad, Bassem, Jianfeng Li, Alberto Castellazzi, Christopher Mark Johnson, Tobias Erlbacher, and Peter Friedriches. Low Inductance 2.5kV Packaging Technology for SiC Switches. 2016.
MLA (9th ed.) CitationMouawad, Bassem, et al. Low Inductance 2.5kV Packaging Technology for SiC Switches. 2016.
Warning: These citations may not always be 100% accurate.