Low inductance 2.5kV packaging technology for SiC switches
The switching speed of power semiconductors has reached levels where conventional semiconductors packages limit the achievable performance due to relatively high parasitic inductance and capacitance. This paper presents a novel packaging structure which employs stacked substrate and flexible printed...
| Main Authors: | , , , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2016
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| Online Access: | https://eprints.nottingham.ac.uk/37318/ |