APA (7th ed.) Citation

Li, J., Mouawad, B., Castellazzi, A., Friedrichs, P., & Johnson, C. M. (2016). Low parasitic inductance multi-chip SiC devices packaging technology.

Chicago Style (17th ed.) Citation

Li, Jianfeng, Bassem Mouawad, Alberto Castellazzi, Peter Friedrichs, and Christopher Mark Johnson. Low Parasitic Inductance Multi-chip SiC Devices Packaging Technology. 2016.

MLA (9th ed.) Citation

Li, Jianfeng, et al. Low Parasitic Inductance Multi-chip SiC Devices Packaging Technology. 2016.