Calibration of a novel microstructural damage model for wire bonds

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Calibration of a novel microstructural damage model for wire bonds

In a previous paper, a new time-domain damage-based physics model was proposed for the lifetime prediction of wire bond interconnects in power electronic modules. Unlike cycle-dependent life prediction methodologies, this model innovatively incorporates temperature- and time-dependent properties so...

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Bibliographic Details
Main Authors:	Yang, L., Agyakwa, P.A., Johnson, C.M.
Format:	Article
Published:	Institute of Electrical and Electronics Engineers 2014
Online Access:	https://eprints.nottingham.ac.uk/36305/

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