Calibration of a novel microstructural damage model for wire bonds
In a previous paper, a new time-domain damage-based physics model was proposed for the lifetime prediction of wire bond interconnects in power electronic modules. Unlike cycle-dependent life prediction methodologies, this model innovatively incorporates temperature- and time-dependent properties so...
| Main Authors: | , , |
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| Format: | Article |
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Institute of Electrical and Electronics Engineers
2014
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| Online Access: | https://eprints.nottingham.ac.uk/36305/ |