Yang, L., Agyakwa, P., & Johnson, C. (2014). Calibration of a novel microstructural damage model for wire bonds. Institute of Electrical and Electronics Engineers.
Chicago Style (17th ed.) CitationYang, L., P.A Agyakwa, and C.M Johnson. Calibration of a Novel Microstructural Damage Model for Wire Bonds. Institute of Electrical and Electronics Engineers, 2014.
MLA (9th ed.) CitationYang, L., et al. Calibration of a Novel Microstructural Damage Model for Wire Bonds. Institute of Electrical and Electronics Engineers, 2014.
Warning: These citations may not always be 100% accurate.