Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment

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Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment

Both real Si insulated gate bipolar transistors (IGBT) with conventional Ni\Ag metallization and a dummy Si die with thickened Ni\Ag metallization have been bonded on Ag foils electroplated with 2.7 m and 6.8 m thick Sn as an interlayer at 250ºC for 0 min, 40 min and 640 min. From microstructure cha...

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Bibliographic Details
Main Authors:	Li, Jianfeng, Agyakwa, Pearl, Johnson, Christopher Mark
Format:	Article
Published:	Springer 2014
Subjects:	Transient liquid phase (TLP) bonding; Die attachment; Diffusion; Interfacial reaction; Intermetallic compounds; Solid solution
Online Access:	https://eprints.nottingham.ac.uk/36300/

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