Li, J., Agyakwa, P., & Johnson, C. M. (2014). Suitable thicknesses of base metal and interlayer, and evolution of phases for Ag/Sn/Ag transient liquid-phase joints used for power die attachment. Springer.
Chicago Style (17th ed.) CitationLi, Jianfeng, Pearl Agyakwa, and Christopher Mark Johnson. Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient Liquid-phase Joints Used for Power Die Attachment. Springer, 2014.
MLA (9th ed.) CitationLi, Jianfeng, et al. Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient Liquid-phase Joints Used for Power Die Attachment. Springer, 2014.
Warning: These citations may not always be 100% accurate.