On-line quality monitoring and lifetime prediction of thick Al wire bonds using signals obtained from ultrasonic generator
Abstract The reliable performance of power electronic modules has been a concern for many years due to their increased use in applications which demand high availability and longer lifetimes. Thick Al wire bonding is a key technique for providing interconnections in power electronic modules. Today,...
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| Format: | Thesis (University of Nottingham only) |
| Language: | English |
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2016
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| Online Access: | https://eprints.nottingham.ac.uk/35881/ |