Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles

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Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles

3 mm × 3 mm dummy SiC dies with 100\200\200 nm thick Ti\W\Au metallization have simultaneously been attached using sintering of Ag nanoparticle paste on AlN-based direct bonded copper substrates with 5\0.1 μm thick NiP\Au finish. The effect of preparation and sintering parameters including time of d...

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Bibliographic Details
Main Authors:	Li, Jianfeng, Johnson, Christopher Mark, Buttay, Cyril, Sabbah, Wissam, Azzopardi, Stéphane
Format:	Article
Published:	Elsevier 2015
Subjects:	Nanoscale silver paste; sintering; shear strength; SiC power die attachment
Online Access:	https://eprints.nottingham.ac.uk/33372/

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