Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles
3 mm × 3 mm dummy SiC dies with 100\200\200 nm thick Ti\W\Au metallization have simultaneously been attached using sintering of Ag nanoparticle paste on AlN-based direct bonded copper substrates with 5\0.1 μm thick NiP\Au finish. The effect of preparation and sintering parameters including time of d...
| Main Authors: | , , , , |
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| Format: | Article |
| Published: |
Elsevier
2015
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/33372/ |