APA (7th ed.) Citation

Li, J., Johnson, C. M., Buttay, C., Sabbah, W., & Azzopardi, S. (2015). Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles. Elsevier.

Chicago Style (17th ed.) Citation

Li, Jianfeng, Christopher Mark Johnson, Cyril Buttay, Wissam Sabbah, and Stéphane Azzopardi. Bonding Strength of Multiple SiC Die Attachment Prepared by Sintering of Ag Nanoparticles. Elsevier, 2015.

MLA (9th ed.) Citation

Li, Jianfeng, et al. Bonding Strength of Multiple SiC Die Attachment Prepared by Sintering of Ag Nanoparticles. Elsevier, 2015.