Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K

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Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K

Ultrasonically bonded heavy Al wires subjected to a small junction temperature fluctuation under power cycling from 40°C to 70°C were investigated using a non-destructive three-dimensional (3-D) x-ray tomography evaluation approach. The occurrence of irreversible deformation of the microstructure an...

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Bibliographic Details
Main Authors:	Agyakwa, Pearl, Yang, Li, Arjmand, Elahjeh, Evans, Paul, Corfield, Martin, Johnson, Christopher Mark
Format:	Article
Published:	Springer 2016
Subjects:	Aluminum wire bonds power cycling reliability x-ray tomography high cycle thermal fatigue
Online Access:	https://eprints.nottingham.ac.uk/33365/

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