APA (7th ed.) Citation

Agyakwa, P., Yang, L., Arjmand, E., Evans, P., Corfield, M., & Johnson, C. M. (2016). Damage evolution in Al wire bonds subjected to a junction temperature fluctuation of 30 K. Springer.

Chicago Style (17th ed.) Citation

Agyakwa, Pearl, Li Yang, Elahjeh Arjmand, Paul Evans, Martin Corfield, and Christopher Mark Johnson. Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30 K. Springer, 2016.

MLA (9th ed.) Citation

Agyakwa, Pearl, et al. Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30 K. Springer, 2016.