Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement

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Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement

Transient thermal impedancemeasurement is commonly used to characterize the dynamic behaviour of the heat flowpath in power semiconductor packages. This can be used to derive a “structure function”which is a graphical representation of the internal structure of the thermal stack. Changes in the stru...

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Bibliographic Details
Main Authors:	Eleffendi, Mohd. Amir, Yang, Li, Agyakwa, Pearl, Johnson, C. Mark
Format:	Article
Published:	Elsevier 2016
Subjects:	Structure function Reliability Power modules Solder fatigue
Online Access:	https://eprints.nottingham.ac.uk/32823/

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