Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement
Transient thermal impedancemeasurement is commonly used to characterize the dynamic behaviour of the heat flowpath in power semiconductor packages. This can be used to derive a “structure function”which is a graphical representation of the internal structure of the thermal stack. Changes in the stru...
| Main Authors: | , , , |
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| Format: | Article |
| Published: |
Elsevier
2016
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/32823/ |