APA (7th ed.) Citation

Eleffendi, M. A., Yang, L., Agyakwa, P., & Johnson, C. M. (2016). Quantification of cracked area in thermal path of high-powermulti-chip modules using transient thermal impedance measurement. Elsevier.

Chicago Style (17th ed.) Citation

Eleffendi, Mohd. Amir, Li Yang, Pearl Agyakwa, and C. Mark Johnson. Quantification of Cracked Area in Thermal Path of High-powermulti-chip Modules Using Transient Thermal Impedance Measurement. Elsevier, 2016.

MLA (9th ed.) Citation

Eleffendi, Mohd. Amir, et al. Quantification of Cracked Area in Thermal Path of High-powermulti-chip Modules Using Transient Thermal Impedance Measurement. Elsevier, 2016.