Laser drilling of via micro-holes in single-crystal semiconductor substrates using a 1070 nm fibre laser with millisecond pulse widths

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Laser drilling of via micro-holes in single-crystal semiconductor substrates using a 1070 nm fibre laser with millisecond pulse widths

Micro-machining of semiconductors is relevant to fabrication challenges within the semiconductor industry. For via holes for solar cells, laser drilling potentially avoids deep plasma etching which requires sophisticated equipment and corrosive, high purity gases. Other applications include backside...

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Bibliographic Details
Main Authors:	Maclean, Jessica O., Hodson, Jonathan R., Voisey, K.T.
Format:	Article
Published:	SPIE 2015
Subjects:	laser drilling semiconductor hole via metal wrap thru laser 1 micron wavelength silicon sapphire gallium arsenide wafer
Online Access:	https://eprints.nottingham.ac.uk/29402/

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