Laser drilling of via micro-holes in single-crystal semiconductor substrates using a 1070 nm fibre laser with millisecond pulse widths
Micro-machining of semiconductors is relevant to fabrication challenges within the semiconductor industry. For via holes for solar cells, laser drilling potentially avoids deep plasma etching which requires sophisticated equipment and corrosive, high purity gases. Other applications include backside...
| Main Authors: | , , |
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| Format: | Article |
| Published: |
SPIE
2015
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| Subjects: | |
| Online Access: | https://eprints.nottingham.ac.uk/29402/ |