Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules

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Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules

This paper presents a review of the commonly adopted physics-of-failure-based life prediction models for wire bond interconnects in power electronic modules. In the discussed models, lifetime is generally accounted for by loading temperature extremes alone. The influence of the time spent at temper...

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Bibliographic Details
Main Authors:	Yang, Li, Agyakwa, Pearl A., Johnson, C. Mark
Format:	Article
Published:	Institute of Electrical and Electronics Engineers 2013
Online Access:	https://eprints.nottingham.ac.uk/2422/

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