APA (7th ed.) Citation

Yang, L., Agyakwa, P. A., & Johnson, C. M. (2013). Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules. Institute of Electrical and Electronics Engineers.

Chicago Style (17th ed.) Citation

Yang, Li, Pearl A. Agyakwa, and C. Mark Johnson. Physics-of-failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules. Institute of Electrical and Electronics Engineers, 2013.

MLA (9th ed.) Citation

Yang, Li, et al. Physics-of-failure Lifetime Prediction Models for Wire Bond Interconnects in Power Electronic Modules. Institute of Electrical and Electronics Engineers, 2013.