A damage-based time-domain wear-out model for wire bond interconnects in power electronic modules

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A damage-based time-domain wear-out model for wire bond interconnects in power electronic modules

In the Physics-of-Failure based approach to reliability design and assessment, which aims to relate lifetime to the identified root-cause of the potential failures, the development of effective failure mechanism models is a crucial task. The extent and rate of wire bond degradation depends on both...

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Bibliographic Details
Main Author:	Yang, Li
Format:	Thesis (University of Nottingham only)
Language:	English
Published:	2013
Subjects:	Time-domain analysis wire bonding (electronic packaging) electronic packaging reliability
Online Access:	https://eprints.nottingham.ac.uk/13646/

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