Yang, L. (2013). A damage-based time-domain wear-out model for wire bond interconnects in power electronic modules.
Chicago Style (17th ed.) CitationYang, Li. A Damage-based Time-domain Wear-out Model for Wire Bond Interconnects in Power Electronic Modules. 2013.
MLA (9th ed.) CitationYang, Li. A Damage-based Time-domain Wear-out Model for Wire Bond Interconnects in Power Electronic Modules. 2013.
Warning: These citations may not always be 100% accurate.