Chan, K., & Teo, B. (2007). Effect of Ar pressure on grain size of magnetron sputter-deposited Cu thin films. INST ENGINEERING TECHNOLOGY-IET.
Chicago Style (17th ed.) CitationChan, K.Y, and B.S Teo. Effect of Ar Pressure on Grain Size of Magnetron Sputter-deposited Cu Thin Films. INST ENGINEERING TECHNOLOGY-IET, 2007.
MLA (9th ed.) CitationChan, K.Y, and B.S Teo. Effect of Ar Pressure on Grain Size of Magnetron Sputter-deposited Cu Thin Films. INST ENGINEERING TECHNOLOGY-IET, 2007.
Warning: These citations may not always be 100% accurate.