APA (7th ed.) Citation

Wong, H., Mohd Shukor, N., & Amin, N. (2007). Prospective development in diffusion barrier layers for copper metallization in LSI. ELSEVIER SCI LTD.

Chicago Style (17th ed.) Citation

Wong, H.Y, N.F Mohd Shukor, and N. Amin. Prospective Development in Diffusion Barrier Layers for Copper Metallization in LSI. ELSEVIER SCI LTD, 2007.

MLA (9th ed.) Citation

Wong, H.Y, et al. Prospective Development in Diffusion Barrier Layers for Copper Metallization in LSI. ELSEVIER SCI LTD, 2007.