Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films
We investigated the effects of sputtering power and deposition pressure on the electrical and structural properties of dc magnetron sputter-deposited copper films on p-type silicon grown at room temperature. Results from our experiments showed that the deposition rate of the copper films increased p...
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| Format: | Article |
| Language: | English |
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2005
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| Online Access: | http://shdl.mmu.edu.my/2170/ http://shdl.mmu.edu.my/2170/1/1492.pdf |
| _version_ | 1848789982985060352 |
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| author | Chan, Kah-Yoong Teo, Bee-San |
| author_facet | Chan, Kah-Yoong Teo, Bee-San |
| author_sort | Chan, Kah-Yoong |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | We investigated the effects of sputtering power and deposition pressure on the electrical and structural properties of dc magnetron sputter-deposited copper films on p-type silicon grown at room temperature. Results from our experiments showed that the deposition rate of the copper films increased proportionally with the sputtering power. Sputtering power also affected the structural properties of the copper films through the surface diffusion mechanism of the adatom. From the scanning electron microscopy surface analysis, the high sputtering power favored the formation of continuous film. The poor microstructure with voided boundaries as a result of low sputtering power deposition was manifested with the high resistivity obtained. The deposition rate was found also depending on the deposition pressure. The deposition pressure had the contrary effect on structural properties of copper films in which high deposition pressure favored the formation of voided boundaries film structure due to the shadowing effect, which varied with different deposition pressure. (c) 2005 Springer Science + Business Media, Inc. |
| first_indexed | 2025-11-14T18:05:23Z |
| format | Article |
| id | mmu-2170 |
| institution | Multimedia University |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T18:05:23Z |
| publishDate | 2005 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-21702011-09-19T08:22:00Z http://shdl.mmu.edu.my/2170/ Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films Chan, Kah-Yoong Teo, Bee-San Q Science (General) We investigated the effects of sputtering power and deposition pressure on the electrical and structural properties of dc magnetron sputter-deposited copper films on p-type silicon grown at room temperature. Results from our experiments showed that the deposition rate of the copper films increased proportionally with the sputtering power. Sputtering power also affected the structural properties of the copper films through the surface diffusion mechanism of the adatom. From the scanning electron microscopy surface analysis, the high sputtering power favored the formation of continuous film. The poor microstructure with voided boundaries as a result of low sputtering power deposition was manifested with the high resistivity obtained. The deposition rate was found also depending on the deposition pressure. The deposition pressure had the contrary effect on structural properties of copper films in which high deposition pressure favored the formation of voided boundaries film structure due to the shadowing effect, which varied with different deposition pressure. (c) 2005 Springer Science + Business Media, Inc. 2005-11 Article NonPeerReviewed application/pdf en http://shdl.mmu.edu.my/2170/1/1492.pdf Chan, Kah-Yoong and Teo, Bee-San (2005) Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films. Journal of Materials Science, 40 (22). pp. 5971-5981. ISSN 0022-2461 http://dx.doi.org/10.1007/s10853-005-1362-8 doi:10.1007/s10853-005-1362-8 doi:10.1007/s10853-005-1362-8 |
| spellingShingle | Q Science (General) Chan, Kah-Yoong Teo, Bee-San Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films |
| title | Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films |
| title_full | Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films |
| title_fullStr | Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films |
| title_full_unstemmed | Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films |
| title_short | Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films |
| title_sort | sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films |
| topic | Q Science (General) |
| url | http://shdl.mmu.edu.my/2170/ http://shdl.mmu.edu.my/2170/ http://shdl.mmu.edu.my/2170/ http://shdl.mmu.edu.my/2170/1/1492.pdf |