APA (7th ed.) Citation

Chan, K., & Teo, B. (2005). Sputtering power and deposition pressure effects on the electrical and structural properties of copper thin films.

Chicago Style (17th ed.) Citation

Chan, Kah-Yoong, and Bee-San Teo. Sputtering Power and Deposition Pressure Effects on the Electrical and Structural Properties of Copper Thin Films. 2005.

MLA (9th ed.) Citation

Chan, Kah-Yoong, and Bee-San Teo. Sputtering Power and Deposition Pressure Effects on the Electrical and Structural Properties of Copper Thin Films. 2005.

Warning: These citations may not always be 100% accurate.