Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique

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Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique

This paper addresses the influences of film thickness on structural and electrical properties of dc magnetron sputter-deposited copper (Cu) films on p-type silicon. Cu films with thicknesses of 130-1050 nm were deposited from Cu target at sputtering power of 125 W in argon ambient gas pressure of 3....

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Bibliographic Details
Main Authors:	CHAN, K, TOU, T, TEO, B
Format:	Article
Language:	English
Published:	2006
Subjects:	TA Engineering (General). Civil engineering (General)
Online Access:	http://shdl.mmu.edu.my/1951/ http://shdl.mmu.edu.my/1951/1/1308.pdf

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