Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique
This paper addresses the influences of film thickness on structural and electrical properties of dc magnetron sputter-deposited copper (Cu) films on p-type silicon. Cu films with thicknesses of 130-1050 nm were deposited from Cu target at sputtering power of 125 W in argon ambient gas pressure of 3....
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
2006
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| Subjects: | |
| Online Access: | http://shdl.mmu.edu.my/1951/ http://shdl.mmu.edu.my/1951/1/1308.pdf |