APA (7th ed.) Citation

CHAN, K., TOU, T., & TEO, B. (2006). Thickness dependence of the structural and electrical properties of copper films deposited by dc magnetron sputtering technique.

Chicago Style (17th ed.) Citation

CHAN, K., T. TOU, and B. TEO. Thickness Dependence of the Structural and Electrical Properties of Copper Films Deposited by Dc Magnetron Sputtering Technique. 2006.

MLA (9th ed.) Citation

CHAN, K., et al. Thickness Dependence of the Structural and Electrical Properties of Copper Films Deposited by Dc Magnetron Sputtering Technique. 2006.