Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography

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Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography

This paper focuses on a failure analysis method on one common power IC failure encountered in the production lines. The new methodology utilizing liquid crystal thermography successfully shortens the total cycle time needed to detect the bond cratering defect and its root cause analysis. The decapsu...

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Bibliographic Details
Main Authors:	Lau, C. K., Sim, K. S., Tso, C. P., Ting, H. Y.
Format:	Conference or Workshop Item
Published:	2009
Subjects:	T Technology (General) QA75.5-76.95 Electronic computers. Computer science
Online Access:	http://shdl.mmu.edu.my/1908/

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