Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography
This paper focuses on a failure analysis method on one common power IC failure encountered in the production lines. The new methodology utilizing liquid crystal thermography successfully shortens the total cycle time needed to detect the bond cratering defect and its root cause analysis. The decapsu...
| Main Authors: | , , , |
|---|---|
| Format: | Conference or Workshop Item |
| Published: |
2009
|
| Subjects: | |
| Online Access: | http://shdl.mmu.edu.my/1908/ |