Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography
This paper focuses on a failure analysis method on one common power IC failure encountered in the production lines. The new methodology utilizing liquid crystal thermography successfully shortens the total cycle time needed to detect the bond cratering defect and its root cause analysis. The decapsu...
| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2009
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| Subjects: | |
| Online Access: | http://shdl.mmu.edu.my/1908/ |
| _version_ | 1848789910976200704 |
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| author | Lau, C. K. Sim, K. S. Tso, C. P. Ting, H. Y. |
| author_facet | Lau, C. K. Sim, K. S. Tso, C. P. Ting, H. Y. |
| author_sort | Lau, C. K. |
| building | MMU Institutional Repository |
| collection | Online Access |
| description | This paper focuses on a failure analysis method on one common power IC failure encountered in the production lines. The new methodology utilizing liquid crystal thermography successfully shortens the total cycle time needed to detect the bond cratering defect and its root cause analysis. The decapsulated defective parts are subjected to suitable biasing current in liquid crystal thermography analysis to detect any hot spot emerging from the sides of the bonded aluminum wedge. This new method proves to be more effective and lower cost than the traditional decapsulation and delayering method. |
| first_indexed | 2025-11-14T18:04:14Z |
| format | Conference or Workshop Item |
| id | mmu-1908 |
| institution | Multimedia University |
| institution_category | Local University |
| last_indexed | 2025-11-14T18:04:14Z |
| publishDate | 2009 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | mmu-19082011-09-23T08:27:09Z http://shdl.mmu.edu.my/1908/ Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography Lau, C. K. Sim, K. S. Tso, C. P. Ting, H. Y. T Technology (General) QA75.5-76.95 Electronic computers. Computer science This paper focuses on a failure analysis method on one common power IC failure encountered in the production lines. The new methodology utilizing liquid crystal thermography successfully shortens the total cycle time needed to detect the bond cratering defect and its root cause analysis. The decapsulated defective parts are subjected to suitable biasing current in liquid crystal thermography analysis to detect any hot spot emerging from the sides of the bonded aluminum wedge. This new method proves to be more effective and lower cost than the traditional decapsulation and delayering method. 2009-07 Conference or Workshop Item NonPeerReviewed Lau, C. K. and Sim, K. S. and Tso, C. P. and Ting, H. Y. (2009) Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography. In: Conference on Innovative Technologies in Intelligent Systems and Industrial Applications , JUL 25-26, 2009, Kuala Lumpur, MALAYSIA. http://dx.doi.org/10.1109/CITISIA.2009.5224221 doi:10.1109/CITISIA.2009.5224221 doi:10.1109/CITISIA.2009.5224221 |
| spellingShingle | T Technology (General) QA75.5-76.95 Electronic computers. Computer science Lau, C. K. Sim, K. S. Tso, C. P. Ting, H. Y. Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography |
| title | Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography |
| title_full | Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography |
| title_fullStr | Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography |
| title_full_unstemmed | Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography |
| title_short | Detection of bond cratering defects under aluminum wedge bond using I-V characteristics and liquid crystal thermography |
| title_sort | detection of bond cratering defects under aluminum wedge bond using i-v characteristics and liquid crystal thermography |
| topic | T Technology (General) QA75.5-76.95 Electronic computers. Computer science |
| url | http://shdl.mmu.edu.my/1908/ http://shdl.mmu.edu.my/1908/ http://shdl.mmu.edu.my/1908/ |