Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology
In this paper, response surface methodology (RSM) was utilized for the experiment design of CuSO4 and H2SO4 concentrations and current densities. RSM was also used to evaluate the significance of each parameter and its interaction on the adhesion strength of austenitic stainless steel substrate. Adh...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications
2017
|
| Subjects: | |
| Online Access: | http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/1/AMM.864.121.pdf |
| _version_ | 1848784628230389760 |
|---|---|
| author | Mohamed Haider, Farag I. ,, Suryanto Ani, Mohd Hanafi Mahmood, Mahmood Hameed |
| author_facet | Mohamed Haider, Farag I. ,, Suryanto Ani, Mohd Hanafi Mahmood, Mahmood Hameed |
| author_sort | Mohamed Haider, Farag I. |
| building | IIUM Repository |
| collection | Online Access |
| description | In this paper, response surface methodology (RSM) was utilized for the experiment design of CuSO4 and H2SO4 concentrations and current densities. RSM was also used to evaluate the significance of each parameter and its interaction on the adhesion strength of austenitic stainless steel substrate. Adhesion strength was investigated by a Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). Results showed that increasing the concentration of CuSO4 and decreasing that of H2SO4 strengthens adhesion. Conversely, the current density only has a slight effect. |
| first_indexed | 2025-11-14T16:40:16Z |
| format | Article |
| id | iium-55777 |
| institution | International Islamic University Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T16:40:16Z |
| publishDate | 2017 |
| publisher | Trans Tech Publications |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | iium-557772018-02-04T11:02:37Z http://irep.iium.edu.my/55777/ Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology Mohamed Haider, Farag I. ,, Suryanto Ani, Mohd Hanafi Mahmood, Mahmood Hameed TA401 Materials of engineering and construction In this paper, response surface methodology (RSM) was utilized for the experiment design of CuSO4 and H2SO4 concentrations and current densities. RSM was also used to evaluate the significance of each parameter and its interaction on the adhesion strength of austenitic stainless steel substrate. Adhesion strength was investigated by a Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). Results showed that increasing the concentration of CuSO4 and decreasing that of H2SO4 strengthens adhesion. Conversely, the current density only has a slight effect. Trans Tech Publications 2017-04-27 Article PeerReviewed application/pdf en http://irep.iium.edu.my/55777/1/AMM.864.121.pdf Mohamed Haider, Farag I. and ,, Suryanto and Ani, Mohd Hanafi and Mahmood, Mahmood Hameed (2017) Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology. Applied Mechanics and Materials, 864. pp. 121-126. ISSN 1662-7482 http://www.scientific.net doi:10.4028/www.scientific.net/AMM.864.121 |
| spellingShingle | TA401 Materials of engineering and construction Mohamed Haider, Farag I. ,, Suryanto Ani, Mohd Hanafi Mahmood, Mahmood Hameed Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology |
| title | Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology |
| title_full | Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology |
| title_fullStr | Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology |
| title_full_unstemmed | Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology |
| title_short | Evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology |
| title_sort | evaluation of the effects of copper electroplating parameters on the adhesion using response surface methodology |
| topic | TA401 Materials of engineering and construction |
| url | http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/ http://irep.iium.edu.my/55777/1/AMM.864.121.pdf |