Influences of additives on copper film quality and gap filling capability of plating process

Bibliographic Details
Main Authors: Mridha, Shahjahan, Law, Shao Beng
Format: Book Chapter
Language:English
Published: IIUM Press 2011
Subjects:
Online Access:http://irep.iium.edu.my/19353/
http://irep.iium.edu.my/19353/1/chp6.pdf
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author Mridha, Shahjahan
Law, Shao Beng
author_facet Mridha, Shahjahan
Law, Shao Beng
author_sort Mridha, Shahjahan
building IIUM Repository
collection Online Access
first_indexed 2025-11-14T15:00:43Z
format Book Chapter
id iium-19353
institution International Islamic University Malaysia
institution_category Local University
language English
last_indexed 2025-11-14T15:00:43Z
publishDate 2011
publisher IIUM Press
recordtype eprints
repository_type Digital Repository
spelling iium-193532012-09-05T00:19:04Z http://irep.iium.edu.my/19353/ Influences of additives on copper film quality and gap filling capability of plating process Mridha, Shahjahan Law, Shao Beng TJ Mechanical engineering and machinery IIUM Press 2011 Book Chapter PeerReviewed application/pdf en http://irep.iium.edu.my/19353/1/chp6.pdf Mridha, Shahjahan and Law, Shao Beng (2011) Influences of additives on copper film quality and gap filling capability of plating process. In: Contemporary metallic materials. IIUM Press, Kuala Lumpur, pp. 34-40. ISBN 9789674181642 http://rms.research.iium.edu.my/bookstore/default.aspx
spellingShingle TJ Mechanical engineering and machinery
Mridha, Shahjahan
Law, Shao Beng
Influences of additives on copper film quality and gap filling capability of plating process
title Influences of additives on copper film quality and gap filling capability of plating process
title_full Influences of additives on copper film quality and gap filling capability of plating process
title_fullStr Influences of additives on copper film quality and gap filling capability of plating process
title_full_unstemmed Influences of additives on copper film quality and gap filling capability of plating process
title_short Influences of additives on copper film quality and gap filling capability of plating process
title_sort influences of additives on copper film quality and gap filling capability of plating process
topic TJ Mechanical engineering and machinery
url http://irep.iium.edu.my/19353/
http://irep.iium.edu.my/19353/
http://irep.iium.edu.my/19353/1/chp6.pdf