Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film

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Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film

In this paper, we investigate the interfacial behavior of a thin one-dimensional (1D) hexagonal quasicrystal (QC) film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation. The contact interface is assumed to be non-slipping, with both perfectly bonded and debonded...

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Bibliographic Details
Main Authors:	Dang, H., Qi, D., Zhao, M., Fan, C., Lu, Chunsheng
Format:	Journal Article
Published:	2023
Online Access:	http://hdl.handle.net/20.500.11937/94652

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