Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film
In this paper, we investigate the interfacial behavior of a thin one-dimensional (1D) hexagonal quasicrystal (QC) film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation. The contact interface is assumed to be non-slipping, with both perfectly bonded and debonded...
| Main Authors: | , , , , |
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| Format: | Journal Article |
| Published: |
2023
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| Online Access: | http://hdl.handle.net/20.500.11937/94652 |