Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film
In this paper, we investigate the interfacial behavior of a thin one-dimensional (1D) hexagonal quasicrystal (QC) film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation. The contact interface is assumed to be non-slipping, with both perfectly bonded and debonded...
| Main Authors: | , , , , |
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| Format: | Journal Article |
| Published: |
2023
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| Online Access: | http://hdl.handle.net/20.500.11937/94652 |
| _version_ | 1848765895595261952 |
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| author | Dang, H. Qi, D. Zhao, M. Fan, C. Lu, Chunsheng |
| author_facet | Dang, H. Qi, D. Zhao, M. Fan, C. Lu, Chunsheng |
| author_sort | Dang, H. |
| building | Curtin Institutional Repository |
| collection | Online Access |
| description | In this paper, we investigate the interfacial behavior of a thin one-dimensional (1D) hexagonal quasicrystal (QC) film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation. The contact interface is assumed to be non-slipping, with both perfectly bonded and debonded boundary conditions. The Fourier transform technique is adopted to establish the integral equations in terms of interfacial shear stress, which are solved as a linear algebraic system by approximating the unknown phonon interfacial shear stress via the series expansion of the Chebyshev polynomials. The expressions are explicitly obtained for the phonon interfacial shear stress, internal normal stress, and stress intensity factors (SIFs). Finally, based on numerical calculations, we briefly discuss the effects of the material mismatch, the geometry of the QC film, and the debonded length and location on stresses and SIFs. |
| first_indexed | 2025-11-14T11:42:31Z |
| format | Journal Article |
| id | curtin-20.500.11937-94652 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T11:42:31Z |
| publishDate | 2023 |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-946522024-05-03T02:26:43Z Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film Dang, H. Qi, D. Zhao, M. Fan, C. Lu, Chunsheng In this paper, we investigate the interfacial behavior of a thin one-dimensional (1D) hexagonal quasicrystal (QC) film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation. The contact interface is assumed to be non-slipping, with both perfectly bonded and debonded boundary conditions. The Fourier transform technique is adopted to establish the integral equations in terms of interfacial shear stress, which are solved as a linear algebraic system by approximating the unknown phonon interfacial shear stress via the series expansion of the Chebyshev polynomials. The expressions are explicitly obtained for the phonon interfacial shear stress, internal normal stress, and stress intensity factors (SIFs). Finally, based on numerical calculations, we briefly discuss the effects of the material mismatch, the geometry of the QC film, and the debonded length and location on stresses and SIFs. 2023 Journal Article http://hdl.handle.net/20.500.11937/94652 10.1007/s10483-023-2989-7 restricted |
| spellingShingle | Dang, H. Qi, D. Zhao, M. Fan, C. Lu, Chunsheng Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film |
| title | Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film |
| title_full | Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film |
| title_fullStr | Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film |
| title_full_unstemmed | Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film |
| title_short | Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film |
| title_sort | thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film |
| url | http://hdl.handle.net/20.500.11937/94652 |