Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging

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Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging

Bibliographic Details
Main Authors:	Debnath, Sujan, Murthy, M., Seetharamu, K., Hassan, A.
Other Authors:	University Technology Mara
Format:	Conference Paper
Published:	University Technology Mara 2009
Online Access:	http://hdl.handle.net/20.500.11937/8560

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