Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging
| Main Authors: | , , , |
|---|---|
| Other Authors: | |
| Format: | Conference Paper |
| Published: |
University Technology Mara
2009
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| Online Access: | http://hdl.handle.net/20.500.11937/8560 |
| _version_ | 1848745693964926976 |
|---|---|
| author | Debnath, Sujan Murthy, M. Seetharamu, K. Hassan, A. |
| author2 | University Technology Mara |
| author_facet | University Technology Mara Debnath, Sujan Murthy, M. Seetharamu, K. Hassan, A. |
| author_sort | Debnath, Sujan |
| building | Curtin Institutional Repository |
| collection | Online Access |
| first_indexed | 2025-11-14T06:21:25Z |
| format | Conference Paper |
| id | curtin-20.500.11937-8560 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T06:21:25Z |
| publishDate | 2009 |
| publisher | University Technology Mara |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-85602017-10-02T02:27:28Z Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging Debnath, Sujan Murthy, M. Seetharamu, K. Hassan, A. University Technology Mara 2009 Conference Paper http://hdl.handle.net/20.500.11937/8560 University Technology Mara fulltext |
| spellingShingle | Debnath, Sujan Murthy, M. Seetharamu, K. Hassan, A. Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging |
| title | Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging |
| title_full | Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging |
| title_fullStr | Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging |
| title_full_unstemmed | Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging |
| title_short | Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging |
| title_sort | improved engineering model for interfacial shearing stress analysis of a heated three layered structure in electronic packaging |
| url | http://hdl.handle.net/20.500.11937/8560 |