APA (7th ed.) Citation

Debnath, S., Murthy, M., Seetharamu, K., Hassan, A., & Mara, U. T. (2009). Improved engineering model for interfacial shearing stress analysis of a heated three layered structure in Electronic Packaging. University Technology Mara.

Chicago Style (17th ed.) Citation

Debnath, Sujan, M. Murthy, K. Seetharamu, A. Hassan, and University Technology Mara. Improved Engineering Model for Interfacial Shearing Stress Analysis of a Heated Three Layered Structure in Electronic Packaging. University Technology Mara, 2009.

MLA (9th ed.) Citation

Debnath, Sujan, et al. Improved Engineering Model for Interfacial Shearing Stress Analysis of a Heated Three Layered Structure in Electronic Packaging. University Technology Mara, 2009.