Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor

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Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor

In this paper, we study a penny-shaped crack model with electrically and thermally semi-permeable boundary conditions in a three-dimensional transversely isotropic piezoelectric semiconductor. An extended displacement discontinuity boundary element method together with an iterative process is propos...

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Bibliographic Details
Main Authors:	Yang, C.H., Zhao, M.H., Lu, Chunsheng, Zhang, Q.Y.
Format:	Journal Article
Published:	2021
Online Access:	http://hdl.handle.net/20.500.11937/85069

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