Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor
In this paper, we study a penny-shaped crack model with electrically and thermally semi-permeable boundary conditions in a three-dimensional transversely isotropic piezoelectric semiconductor. An extended displacement discontinuity boundary element method together with an iterative process is propos...
| Main Authors: | , , , |
|---|---|
| Format: | Journal Article |
| Published: |
2021
|
| Online Access: | http://hdl.handle.net/20.500.11937/85069 |